Global SemiConsortium
- Holst Centre¨
- オランダのTNO (炳脫彩池甫墊怠菇)とベルギ〖のIMECが鼎票で肋惟した甫墊疥。フィリップス家の甫墊センタ〖の雷孟に肋彌。
- IME (Institute of Microelectronics)- A*STAR¨
- シンガポ〖ルの彩池禱窖甫墊模 (A*STAR)槐布にある染瞥攣甫墊疥。LSIプロセスから悸劉 (3D IC)に魂るまで、SiだけではなくGaNやSiCについても甫墊している。
- IMEC (Interuniversity Microelectronics Centre)¨
- ベルギ〖にある染瞥攣禱窖の甫墊疥。坤腸面から客亨が礁まり、染瞥攣の肋紛、瀾隴、炳脫などについて甫墊する。
- ITRI (Industrial Technology Research Institute )¨
- 1973鉗に駱涎で肋惟された甫墊倡券怠菇。彩池禱窖の甫墊倡券により、緩度券鷗と沸貉擦猛を料隴し、家柴省匯を樓渴することをミッションとする。
- LETI (Laboratoire d'Electronique des Technologies de I'information)¨
- フランスの彩池禱窖模CEAの面にある排灰攫鼠禱窖甫墊疥。STMicroelectronicsなどと泰に寵瓢している。MEMS禱窖は年刪がある。
- NMI (National Microelectronics Institute)¨
- 毖柜の染瞥攣措度が礁まる潤蹦網(wǎng)の度腸媚攣。
- SRC (Semiconductor Research Corp)¨
- 勢柜の染瞥攣甫墊を夸渴する絡池のコンソ〖シアム。
2025
- 2025/9/9
- ITRI: Semicon Network Summit Draws Industry Leaders From 28 Countries With a Call for Trusted Global Cooperation
- 2025/9/2
- Holst Centre: TNO at Holst Centre welcomes R&D team Dai Nippon Printing
- 2025/7/4
- IME: A*STAR And Siemens Collaborate To Advance Smart And Sustainable Manufacturing Solutions
- 2025/7/4
- ITRI Advances Taiwan∏s 6G Global Partnerships in the EU and the UK
- 2025/7/1
- IME: NSTIC (GaN) Launched to Lead Singapore in Advanced GaN Semiconductor Innovation
- 2025/6/20
- LETI: EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe∏s 1st Commercial Supplier of LNOI Wafers
- 2025/6/19
- NMI: TechWorks and Canadian Semiconductor Council Sign Memorandum of Understanding to Strengthen UK – Canadian Semiconductor Innovation and Collaboration
- 2025/6/18
- CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits
- 2025/6/16
- Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes
- 2025/6/16
- LETI: Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
- 2025/6/12
- Imec achieves record-breaking RF GaN-on-Si transistor performance for high-efficiency 6G power amplifiers
- 2025/6/11
- Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission
- 2025/6/5
- Imec and Ghent University present a fully-integrated, single-chip microwave photonics system for compact and versatile signal processing
- 2025/6/6
- LETI: FAMES Pilot Line Launches FAMES Academy To Train Europe∏s Chip Engineers with Skills to Leverage FD-SOI Technology and Design Circuits Using Advanced Setups
- 2025/6/3
- Imec demonstrates 16nm pitch Ru lines with record-low resistance obtained using a semi-damascene integration approach
- 2025/5/29
- ITRI, MediaTek, and Chunghwa Telecom Advance Satellite-Ready B5G Infrastructure
- 2025/5/28
- ITRI Opens UK Office and Launches Collaboration With Catapult Network
- 2025/5/27
- IMEC: 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
- 2025/5/27
- LETI: Towards next-generation edge-AI technologies: EU consortium opens services to external customers
- 2025/5/22
- IME: A*STAR's Inaugural "Innovate Together" Showcases Singapore's Semiconductor Ambitions On Global Stage
- 2025/5/21
- Imec Joins Forces with MIT∏s RLE, MTL and IMES to Accelerate Personalized Healthcare
- 2025/5/13
- NMI: centrotherm clean solutions Becomes Pfeiffer Vacuum+Fab Solutions
- 2025/5/7
- Holst Centre launches photonics lab boosting research and development for integrated photonics in the Netherlands
- 2025/5/7
- Imec and TNO launch Holst Centre Photonics Lab
- 2025/4/29
- Imec coordinates EU Chips Design Platform
- 2025/4/3
- Imec identifies stable operating range for GaN MISHEMTs in RF power amplifiers
- 2025/4/2
- NMI: IceMOS Technology Closes $22 Million Series E Investment to Fund Launch of New Power Semiconductor Device Technology mSJMOSTM ™
- 2025/3/31
- Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar
- 2025/3/24
- IME: National Robotics Programme Launches Robonexus To Help Singapore-based Robotics Startups And SMEs Go Global
- 2025/3/24
- IMEC: InSiDe, a European R&D project targeting mobile early-stage cardiovascular disease diagnosis - using Laser Doppler Vibrometry
- 2025/3/20
- Imec and ZEISS intensify collaboration with the signing of a new Strategic Partnership Agreement
- 2025/3/14
- ITRI Launches World-Leading Multi-Orbit 5G NTN Trials With Key Ecosystem Partners
- 2025/2/28
- IME: A*STAR And MojiaBio To Develop Next-gen Sustainable Biomanufacturing Platform In Singapore
- 2025/2/24
- Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning
- 2025/2/19
- CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction
- 2025/2/19
- Leti: UC San Diego and CEA-Leti Scientists Report Breakthrough Microactuator Driving System at ISSCC 2025
- 2025/2/18
- ITRI Showcases UAV Innovations at XPONENTIAL Europe 2025
- 2025/1/30
- CEA-Leti Builds Pathways to Improved Chemical Detection, High-Speed Communication and LIDAR Performance Via Integrated Optics-on-Silicon Advances
- 2025/1/9
- IMEC: First full wafer-scale fabrication of electrically-pumped GaAs-based nano-ridge lasers on 300 mm silicon wafers
- 2025/1/9
- ITRI Opens CES 2025 With Trend-Leading Showcase and Partnership With Reliance Biotech Corporation
- 2025/1/9
- LETI: Silicon Photonics Pioneer CEA-Leti Will Unveil Major R&D Gains At Photonics West, Jan. 25-30, Including Invited Paper On Optical Phased Arrays for LiDAR Applications
- 2025/1/7
- Imec and partners show outdoor stability of highly anticipated perovskite solar modules
- 2025/1/5
- ITRI Unveils Cutting-Edge Smart Medical Technology at CES 2025
- 2025/1/3
- ITRI Introduces Wellness Technologies at CES 2025
2024
- 2024/12/26
- ITRI and Daicel Group Join Forces in Accelerator Program
- 2024/12/16
- Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
- 2024/12/12
- Imec proposes 3D charge-coupled device with IGZO channel as buffer memory for data-intensive compute applications
- 2024/12/12
- CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
- 2024/12/10
- Holst Centre: Pioneering innovations in Organ-on-Chip technology
- 2024/12/10
- Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
- 2024/12/9
- Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz
- 2024/12/9
- CEA-Leti Device Integrates Light Sensing & Modulation, Bringing Key Scalability, Compactness and Optical-Alignment Advantages
- 2024/12/7
- Imec proposes double-row CFET for the A7 technology node
- 2024/11/13
- IMEC: Skinetix, a new spin-off from imec and Vrije Universiteit Brussel (VUB), develops smart sportswear to maximize athletes∏ performance and speed up post-injury recovery
- 2024/11/8
- ITRI Joins Forces with EU 6G-SANDBOX for Advanced 6G R&D
- 2024/10/31
- SRC: Failure Characterization of Beyond-CMOS Materials & Devices
- 2024/10/24
- Holst Centre: The impact of Bluetooth Low Energy (BLE) on IoT Solutions
- 2024/10/25
- Imec Cambridge UK gets off to a flying start with a funded project to develop cutting-edge Design Space Exploration (DSE) framework for AI training
- 2024/10/15
- CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using Ring-Oscillator-Based Architectures
- 2024/10/10
- IMEC: Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec∏s Automotive Chiplet Program
