PROGRAM SCHEDULE
ISSM2016 Program Schedule at-a-glance(as of Nov 28)
Monday, December 12
Mon, Dec 12 | Tue, Dec 13 | Interactive
Room 1 : KFC Hall
Plenary Session
| 8:00 | Registration |
| 9:00 | Opening |
| 9:20 |
Keynote Speech Minimal Fab using half-inch wafers to reduce a fab investment to 1/1,000 Dr. Shiro Hara, Minimal Fab |
| 10:00 |
Keynote Speech Toyota's Efforts Toward Realizing a Sustainable Society Dr. Takahiro Ito, TOYOTA |
| 10:40 | Break |
| 10:50 |
Keynote Speech An overview of smart factories in Industry 4.0 implementation. Dr. Jonathan Chang, Infineon |
| 11:30 | Lunch Break |
Room 1 : KFC Hall
Highlight Session : IoT and Big Data Solution
| 12:30 |
MC-O-24 : Data Mining Approaches to Optimize the Allocation of Production Resources in Semiconductor Wafer Fabrication Chih-Min Yu, YouThought Corporation |
| 12:50 |
PC-O-51 : ASML : a Decade of Big Data use Rogier Kuijper, ASML |
| 13:10 |
PC-O-62 : Distributed Database and Application Architecture for Big Data Solutions Makoto Misaki, Panasonic |
| 13:30 |
YE-O-50 : A Comprehensive Big-Data-Based" Monitoring System for Yield Enhancement in Semiconductor Manufacturing" Kouta Nakata, Toshiba |
| 13:50 | Author's Interview & Break |
| 14:10 |
YE-O-13 : Visualization technique of maintenance work with motion capture sensors Munehito Kagaya, Tokyo Electron |
| 14:30 |
PC-O-71 : Unstructured Data Treatment for Big Data Solutions Shintaro Sato, Panasonic |
| 14:50 |
PC-O-60 : Automatic Property Visualization for Material Survey Support Masayuki Okamoto, Toshiba |
| 15:10 | Author's Interview & Break |
Room 1 : KFC Hall
Session : Manufacturing Control and Execution (MC) & eMDC Invited
| 15:30 |
<eMDC2016 Invited> : Prioritization of Key In-Line Process Parameters for Electrical Characteristic Optimization of 16-nm High-k Metal Gate Bulk FinFET Devices Dr. Ping-Hsun Su, National Chiao Tung University |
| 15:50 |
<eMDC2016 Invited> MC-O-9 : Heuristic Methods for Q-time Bottleneck Dispatching Ching-Lung Chang, Winbond Electronics |
| 16:10 |
<eMDC2016 Invited> MC-O-19 : Generalized Overall Equipment Effectiveness for Integrated Scheduling and Process Control Yu-Ting Kao, National Taiwan University |
| 16:30 |
MC-O-43 : Dynamic Cycle-time Improvement through Big Data Analytics Chih Ming CHAN, GlobalFoundries |
| 16:50 |
MC-O-67 : Simultaneous Assignments of Multiple Types of Production Resources in Semiconductor Manufacturing Hiroyuki Motomiya, University of Tsukuba |
| 17:10 |
MC-O-73 : Optimal Production and Capacity Planning for Make-to-Order type Semiconductor Production Systems Huizhen BU, University of Tsukuba |
| 17:30 | Author's Interview & Break |
| 17:50 | Welcome Reception |
Room2: KFC Hall Annex
Session: Process and Material Optimization (PO)
| 12:30 |
PO-O-21 : Plasma Erosion Behavior of Yttrium Oxide film formed by ADM Hiroaki Ashizawa, TOTO LTD |
| 12:50 |
PO-O-22 : Sub-10 nm Metal Wire Circuit Fabrication using Directed Self-Assembly of Block Copolymers Tsukasa Azuma, Evolving nano process Infrastructure Development Center (EIDEC) |
| 13:10 |
PO-O-30 : EEPROM retention performance modulation by poly Si grain size & dopant distribution Guai Guan Hong, GlobalFoundries |
| 13:30 |
PO-O-31 : STI HDP process effect on yield of embedded memory processes Guai Guan Hong, GlobalFoundries |
| 13:50 | Author's Interview & Break |
| 14:10 |
PO-O-37 : Challenges for immersion lithography extension based on negative tone imaging (NTI) process TORU FUJIMORI, FUJIFILM |
| 14:30 |
PO-O-58 : Improvement of Particle Generation in a Dry Etching Apparatus Tetsuyuki Matsumoto, Toshiba |
| 14:50 |
PO-O-68 : Investigation of plasma-induced damage in silicon trench etching Shuichi Kuboi, Toshiba |
| 15:10 | Author's Interview & Break |
Room2: KFC Hall Annex
Session: Process Control and Monitoring (PC) & Environment, Safety and Health (ES)
| 15:30 |
PC-O-8 : Advanced Fault Detection Method for Chemical Mechanical Polisher Yohei Hamaguchi, Renesas Semiconductor Manufacturing |
| 15:50 |
PC-O-14 : Flash gate optimized process and integration for electrical performances requirement on advanced embedded memory Agharben El Amine, EMSE-CMP |
| 16:10 |
PC-O-42 : Etching Rate Drifts and Drops Induced by Metal Etching Processes Kosuke Yamamoto, Tokyo Electron |
| 16:30 |
PC-O-47 : Developing R2R controller by means of studying the sources of variability in plasma etch process Agnès Roussy, EMSE-CMP |
| 16:50 |
PC-O-59 : Process Optimizer for adjusting film thickness and in-film dopant concentration at the same time Yuichi Takenaga, Tokyo Electron |
| 17:10 |
ES-O-23 : Exploit the value of production data to discover opportunities for saving power consumption by production tools Chih-Min Yu, YouThought Corporation |
| 17:30 | Author's Interview & Break |
| 17:50 | Welcome Reception |
Tuesday, December 13
Mon, Dec 12 | Tue, Dec 13 | Interactive
Room1: KFC Hall
Plenary Session
| 8:30 | Registration |
| 8:55 | Program Outline by Ayako Shimazaki, Toshiba Nanoanalysis, ISSM Program Executive Vice Chairman |
| 9:00 |
Tutorial Changing semiconductor production management system Tetsuya Kubo, Toshiba |
| 9:50 |
Tutorial Semiconductors and their band diagrams Prof. Shinichi Takagi, The University of Tokyo |
| 10:40 | Break |
| 10:50 |
Keynote Speech Toward Sustainable Nanometer Manufacturing Technologies in the 2020s Dr. Jack Sun, TSMC |
| 11:30 |
"Evolution and revitalization of legacy Fabs" Sesssion Keynote An overview of optimized automation of 8-inch fab manufacturing lines Heinz Martin Esser, Fabmatics GmbH |
| 12:10 |
"Evolution and revitalization of legacy Fabs" Sesssion Keynote Challenges and Innovations in a 200mm Wafer Fab Peter Kailbauer, ams AG |
| 12:50 | Lunch Break |
| 13:30 |
Keynote Speech New Era of Electrification and Vehicle Intelligence Dr. Haruyoshi Kumura , Nissan Motor |
| 14:10 | 3mins Summary Presentation by Interactive Poster Speakers |
| 14:40 | Break |
Room1: KFC Hall
Highlight Session : High reliability device process technology for automotive and medical applications
| 14:50 |
DM-O-11 : Layout-based Test Coverage Verification for High Reliability Devices Yoshikazu Nagamura, Renesas Semiconductor Manufacturing |
| 15:10 |
PC-O-55 : New Method of Screening Out Outlier(Expanded "PAT" during Package Test) Tadashi Sakamoto, Japan Semiconductor Corporation |
| 15:30 |
<eMDC2016 Invited> DM-O-63 : Fundamentals of side isolation LDMOS device with 0.35um CMOS compatible process R.Deivasigamani, Asia University |
| 15:50 |
DM-O-65 : Study on High-Side LDMOS Energy Capability Improvement Yun-Jung Lin, Asia University |
| 16:10 |
PO-O-72 : High-Temperature-Resistant Interconnection by Using Nickel Nano-particles for Power Devices Packaging. Tomonori IIZUKA, Waseda University |
| 16:30 | Author's Interview & Break |
Room1: KFC Hall
Session : Process & Metrology Equipment (PE) & Contamination Control and Ultraclean Technology (UC) & Yield Enhancement Methodology (YE)
| 16:50 |
PE-O-10 : Contactless device for the fast conductivity characterization of a large range semiconductors F.LOETE, Centralesupelec |
| 17:10 |
UC-O-7 : Extended Contamination Control in Advanced Wafer Processing Markus Pfeffer, Fraunhofer IISB |
| 17:30 |
UC-O-18 : Investigation into behavior of mobile ions in storage device using ToF-SIMS Nobuhito Kuge, Toshiba |
| 17:50 |
YE-O-56 : STI Si Damage Defect Reduction by HDP Profile Optimizations Shinya Ito, Texas Instruments |
| 18:10 | Author's Interview & Break |
| 18:30 | Poster Session & ISSM Awards |
| 20:00 |
Room2: KFC Hall Annex
Highlight Session : Evolution and revitalization of legacy Fabs
| 14:50 |
MS-O-16 : Fab Labor Productivity Improvement through a Combined Modeling Approach Ariel Meyuhas, The MAX Group |
| 15:10 |
PO-O-4 : A Theoretical Modeling of CMP: A Monte-Carlo Approach Akira Endou, FUJIMI INCORPORATED |
| 15:30 |
PE-O-34 : Metrologies of Behavior of Abrasives for Understanding and UPgrading CMP Process Shohei Shima, EBARA |
| 15:50 |
PO-O-5 : Development of novel CMP slurry for FEOL processes Yasuyuki Yamato, FUJIMI INCORPORATED |
| 16:10 |
UC-O-6 : Particle removal efficiency evaluation of filters in IPA Tomoyuki Takakura, Nihon Pall |
| 16:30 | Author's Interview & Break |
| 16:50 |
UC-O-33 : Analysis method of metal contamination for isopropyl alcohol Kazuya Dobashi, Tokyo Electron |
| 17:10 |
YE-O-26 : Improving Process Tool Productivity by Correct Sealing Material Selection for Plasma Processes Murat Gulcur, IDEX Sealing Solutions - PPE |
| 17:30 |
UC-O-49 : Particle Adsorption onto Si Wafers in Ultrapure Water; its Mechanism and Effect of Carbon Dioxide Koji Nakata, Kurita Water Industries Ltd. |
| 17:50 |
MC-O-41 : Revitalizing the 200mm Fabs through Automation Chih Ming CHAN, GlobalFoundries |
| 18:10 | Author's Interview & Break |
| 18:30 | Poster Session & ISSM Awards |
| 20:00 |
3 minutes summary presentation by interactive poster speakers
Mon, Dec 12 | Tue, Dec 13 | Interactive
Room1: KFC Hall
| 14:10 | Introduction of 3mins summary presentation |
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ES-76 : Development of an energy-saving controller for sub apparatus Toshiya Ozaki, Toshiba |
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MS-77 : Factory Integration Fosus Area in the IRDS Supika Mashiro, Tokyo Electron |
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PC-36 : Next Generation FDC: Dynamic Full Trace Fault Detection Tom Ho, BISTel, Inc |
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PC-38 : Monitoring method for deposited film causing particles in mass-production plasma etching process using a load impedance monitoring system Yuji Kasashima, National Institute of Advanced Industrial Science and Technology(AIST) |
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PO-15 : Self-adjusting boron nitride mask for Reactive-Ion Etching Konrad Schwanitz, WIKA Alexander Wiegand SE & Co. KG |
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PO-17 : Study for Phosphorus Contamination to High Voltage Transistors LIANG, LI, GlobalFoundries |
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PO-61 : Research and development of metal-based resist materials for EUVL Julius Joseph Santillan, Evolving nano process Infrastructure Development Center (EIDEC) |
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PO-64 : The Effect of Slurry pH and Particle Size on LiTaO3 Polishing Kazuki Moriyama, Nittahaas |
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PO-69 : Electrical characterisation of Metal contacts to 4H-SiC Enhanced by Pre-Metallisation Surface Treatment Stanley Luong, RMIT University |