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COMMITTEE

Chairman:: Katsuhiro Tsukamoto, Mitsubishi Electric Corporation
Vice Chairman:: Tadahiro Ohmi, Tohoku University
Committee:: Keiji Horioka, Applied Materials Japan, Inc.; Yoshitake Ito, Omron Corporation; Nobuo Kawase, Canon, Inc.; Haruyoshi Yagi, Fujitsu Semiconductor Limited; Masataka Hirose, National Institute of Advanced Industrial Science and Technology(AIST); Michihiro Inoue, National Institute of Advanced Industrial Science and Technology(AIST); Akikazu Tanimoto, Nikon Corporation; Hirofumi Uchida, Panasonic Corporation; Tatsuo Yoshino, Renesas Electronics Corporation; Tadashi Nishimura, Renesas Electronics Corporation; Takahisa Yamaha, Rohm Co., Ltd.; Teruo Tabata, SANYO Electric Co., Ltd.; Hiroshi Nishioka, Sharp Corporation; Yuji Tsukamoto, Tokyo Electron Limited; Masakazu Shiozaki, Toshiba Corporation

Board Members: Tsuyoshi Kawanishi, TEK Consulting; Hajime Sasaki, NEC Corporation; Satoru Ito, Hitachi, Limited

Committee:: Masahiro Kashiwagi, Kumamoto Industrial Research Institute; Yasuo Mizokami, Molecular Imprints; Yoichi Akasaka, Osaka University; Shigeru Nakayama, SEMI; Kimio Yanagida, Fukushima Prefecture

Chairman:: Michihiro Inoue, National Institute of Advanced Industrial Science and Technology(AIST)
Vice Chairman:: Makoto Hirayama, State University of New York, College of Nanoscale Science and Engineering; Shuuichi Inoue, Renesas Electronics Corporation
Committee:: Keiji Horioka, Applied Materials Japan, Inc.; Kensuke Uriga, Dura Systems, Inc.; Takeshi Hattori, Electronic Journal; Isamu Hanyu, Fujitsu Semiconductor, Limited; Hiroyuki Chuma, Hitotsubashi University; Naoki Kitano, Intel K.K.; Masaomi Kameyama, Nikon, Inc.; Kitamura Kouji, Omron Corporation; Hirofumi Uchida, Panasonic Corporation; Koji Maekawa, PDF Solutions, Inc.; Michio Honma, Renesas Electronics Corporation; Koichi Sakurai, Renesas Electronics Corporation; Akira Kamisawa, Rohm Co.,, Ltd.; Toshio Suganuma, SANYO Electric Co., Ltd.; Kazuma Minami, Seiko Epson Corporation; Yoichi Nakagawa, SEMI; Masayasu Tsunematsu, Semiconductor Equipment Association of Japan（SEAJ); Jun Ueda, Semiconductor Industry Research Institute of Japan(SIRIJ); Osamu Minato, Semiconductor Leadingedge Technologies, Inc. (Selete); Motoshi Omori, Sharp Corporation; Yuji Tsukamoto, Tokyo Electron Limited; Takashi Yoda, Toshiba Corporation

Chairman:: Toshiyuki Uchino, Renesas Electronics Corporation
Executive Vice Chairman:: Ayako Shimazaki, Toshiba Corporation
Vice Chairman:: Kiyotaka Imai, KLA-Tencor Japan Ltd.; Hidetoshi Koike, Toshiba Corporation
Committee leader:: Katsutoshi Ozawa, OMRON Corporation; Shin-ichi Imai, Panasonic Corporation; Isamu Namose, Seiko Epson Corporation
Committee:: Shinsuke Mizuno, Applied Materials Japan, Inc; Eiichi Kawamura, Fujitsu Semiconductor Limited; Kenji Miyake, PMT Corporation; Kenji Watanabe, Hitachi High-Technologies Corporation; Eisuke Nishitani, Hitachi kokusai Electric Inc.; Fumitaka Homma, Oki Semiconductor Miyagi; Takatoshi Yasui, Panasonic Corporation; Takeshi Akimoto, Renesas Electronics Corporation; Michio Honma, Renesas Electronics Corporation; Yoshio Iwata, Renesas Electronics Corporation; Toshiharu Katayama, Renesas Electronics Corporation; Yoshiaki Oku, Rohm Co., Ltd.; Hiroshi Tamagawa, Rohm Co., Ltd.; Tetsuya Miwa, SANYO Semiconductor Co.,Ltd.; Masahiko Minamide, Sharp Corporation; Shinji Ochi, Sony Semiconductor Kyushu Corporation; Yuj Ezaki, Texas Instruments Japan Limited; Takanobu Kaitsuka, Tokyo Electron, Limited; Hiromi Yajima, Toshiba Corporation

Chairman:: Thomas Sonderman, GlobalFoundries
Committee:: Bill Arnold, ASML; Aarthi Venkateshan, Canon Anelva Corporation; Jeff McNeil, Cypress; Lothar Pfitzner, Fraunhofer - IIS-B; Linda Milor, Georgia Tech; Els Van Moorhem, IMEC; Scott Kramer, SEMATECH; Shi-Chung Chang, National Taiwan University; Keith J. Hansen, Novellus Systems Incorporated; Fumitake Mieno, SMIC; Christian Carlier, ST Microelectronics; SY Sheen, TSMC; Risto Puhakka, VLSI Research