ISSM 2008 - INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING

COMMITTEE

Japan Organizing Committee

Chairman:

Satoru Ito, Renesas Technology Corp.

Vice Chairman:

Tadahiro Ohmi, Tohoku University

Chairman Emeritus:

Hajime Sasaki, NEC Corp.

Committee:

Keiji Horioka, Applied Materials Japan Inc.

Nobuo Kawase, Canon Corp.

Haruyoshi Yagi, Fujitsu Microelectronics Ltd.

Hideo Kawasaki, Panasonic Corp.

Michihiro Inoue, Panasonic Corp.

Masataka Hirose, National Institute of Advanced Industrial Science and Technology

Tatsuo Yoshino, NEC Electronics Corp.

Akikazu Tanimoto, Nikon Corp.

Hironori Kitabayashi, Oki SEMICONDUCTOR Co., Ltd.

Yoshitake Ito, OMRON Corp.

Hidemi Takasu, Rohm Co., Ltd.

Tadashi Nishimura, Renesas Technology Corp.

Teruo Tabata, Sanyo Electric Co., Ltd.

Hiroshi Nishioka, Sharp Corp.

Haruo Iwatsu, Tokyo Electron Ltd.

Shunichi Hiraki, Toshiba Corp.

Japan Advisory Board

Members:

Tsuyoshi Kawanishi, TEK Consulting

Japan Advisory Committee

Committee:

Masahiro Kashiwagi, Keio University

Yasuo Mizokami, KLA-Tencor Japan Ltd.

Yoichi Akasaka, Osaka University

Shigeru Nakayama, SEMI

Kimio Yanagida, Tokyo Electron Ltd.

Yasusuke Sumitomo, Toshiba Corp.

Japan Executive Committee

Chairman:

Michihiro Inoue, Panasonic Corp.

Vice Chairman:

Takeshi Hattori, Semiconductor International Japan Edition

Makoto Hirayama, State University of New York, College of Nanoscale Science and Engineering

Committee:

Horioka Keiji, Applied Materials Japan Inc.

Hiroji Iwahori, Canon Corp.

Kensuke Uriga, Dura Systems Ltd.

Toshihiko Osada, Fujitsu Microelectronics Ltd.

Hiroyuki Chuma,Institute of Innovation Research, Hitotsubashi University

Naoki Kitano, Intel K.K.

Shuuichi Inoue, NEC Electronics Corp.

Masaomi Kameyama, Nikon Corp.

Koji Kitamura, OMRON Corp.

Koji Maekawa, PDF Solutions

Toshio Suganuma, SANYO Electric Co., Ltd.

Kazuma Minami, Seiko Epson Corp.

Yoichi Nakagawa, SEMI Japan

Masayasu Tsunematsu, Semiconductor Equipment Association of Japan

Osamu Minato, Semiconductor Leading Edge Technologies, Inc.

Kazuhiro Moritani, Sharp Corp.

Jun Ueda, SIRIJ

Takashi Yoda, Toshiba Corp.

Yoriyuki Murakawa, Realize AT Ltd.

Hajime Iijima, Renesas Technology Corp.

Akira Kamisawa, Rohm Co., Ltd.

Japan Program Committee

Chairman:

Nobuhiro Otsuka, Hitachi, Ltd.

Executive Vice
Chairman:

Toshiyuki Uchino,
Renesas Technology Corp.

Vice Chairman:

Hidetoshi Koike, Toshiba Corp. Semiconductor Company

Kiyotaka Imai, KLA-Tencor Japan Ltd.

Committee:

Kazunori Kato, Advanced Interface Technology Corp.

Shinsuke Mizuno, Applied Materials Japan, Inc.

Eisuke Nishitani, Hitachi Kokusai Electric Inc.

Kenji Watanabe, Hitachi High-Technologies Corp.

Toshihiko Osada, Fujitsu Microelectronics Ltd.

Shin-ichi Imai, Panasonic Corp.

Shinichi Domae, Panasonic Corp.

Takeshi Akimoto, NEC Electronics Corp.

Michio Honma, NEC Electronics Corp.

Harufumi Kobayashi, Oki SEMICONDUCTOR Co., Ltd.

Fumitaka Homma, Oki SEMICONDUCTOR Co., Ltd.

Katsutoshi Ozawa, OMRON Corp.

Yoshio Iwata, Renesas Technology Corp.

Toshiharu Katayama, Renesas Technology Corp.

Yoshiaki Oku, Rohm Co., Ltd.

Masahide Maeda, Rohm Co., Ltd.

Hiroshi Ishizeki, SANYO Semiconductor Co., Ltd.

Tetsuya Miwa, SANYO Semiconductor Co., Ltd.

Isamu Namose, Seiko Epson Corp.

Masahiko Minamide, Sharp Corp.

Atsushi Someya, Sony Corp.

Shouji Tsuruda, Sony Semiconductor Kyushu Corp.

Fumihiko Inoue, Spansion Japan Ltd.

Kenji Miyake, Texas Instruments Japan Ltd. Hiji Plant

Kazuyuki Saito, The University of Aizu

Takanobu Kaitsuka, Tokyo Electron, Ltd.

Ayako Shimazaki, Toshiba Corp. Semiconductor Company

Hiromi Yajima, Toshiba Corp. Semiconductor Company

Kelly Andrew, ULVAC, Inc.

International Executive Committee

Chairman:

Jim Doran, Spansion

Committee:

Thomas Sonderman, AMD

Patrick Lamey, Applied Materials

Mihir Parikh Ph. D., Aquest Systems Corp.

Steve Schwartz, Asyst

Bill Dunnigan, Cypress Semiconductor Company

Rick McFarland, Freescale

Alain C Diebold, IEEE EDS

Peter Kuecher, Infineon

Gerald Elder, Intel

Patricia A. McDonald, Intel

Phillip Moyhagh, Intel

Rick Wallace, KLA-Tencor

Jeff Mendiola, Micron Technology

Paul Edmonds, National Semiconductor

Kim Wisneski, National Semiconductor

Shi-Chung Chang, National Taiwan University

John Chenault, Novellus System

Ajit Manocha, Philips Semiconductor

Young-bum Koh, Samsung

Mike Polcari, SEMATECH

Victoria Hadfield, SEMI

Stanley T. Myers, SEMI

Laurent Bosson, ST Microelectronics

Yoshio Nishi, Stanford University

John Lin, TSMC

Mark Liu, TSMC

Jenn Tsao, UMC

Chia Pin Lee, United Microelectronics Corp.

Dave Hodges, University of California at Berkeley

International Program Committee

Chairman:

Thomas Sonderman, AMD

Committee:

Bill Brennan, AMD/Spansion

Bill Arnold, ASML

Rajendra Singh, Clemson University

Jeff McNeil, Cypress

Lothar Pfitzner, Fraunhofer - IIS-B

Linda Milor, Georgia Tech

Marc Meuris, IMEC

Joerg Domaschke, Infineon

Gerald Elder, Intel

Philip Moynagh, Intel

Steve Swan, National Semiconductor

Shi-Chung Chang, National Taiwan University

Keith Hansen, Novellus

Tae-Sung Kim, Samsung

Chuck Stager,SEMATECH

Scott S. Kramer, SEMATECH

Fumitake Mieno, SMIC

Christian Carlier, ST Microelectronics

John Lin, TSMC

Jenn Tsao, UMC

Chia Pin Lee, United Microelectronics Corp.

Costas Spanos, University of California at Berkeley

Risto Puhakka, VLSI Research

ASHRAF EL SAYED MOHAMED