ISSM2018 Best Paper
Related Conference Information
- e-Manufacturing & Design Collaboration Symposium 2017 was held in Hsinchu, Taiwan, September 9, 2017.
- AEC/APC Symposium Asia 2017 which sponsored by ISSM was held in Japan on November 15, 2017.
ISSM Sponsors
Co Sponsored by: IEEE Electron Devices Society, Minimal Fab, Semiconductor Equipment Association of Japan (SEAJ), Semiconductor Equipment and Materials International (SEMI) and Taiwan Semiconductor Industry Association (TSIA)
Endorsement by The Japan Institute of Electronics Packaging, The Japan Society of Applied Physics
Contact to issm issm_2018@semiconportal.com for further inquiries.